Chapter 1: Motherboards, Processors & Memory

A+ Core 1 — 220-1101 | Domain 3.4, 3.5

Chapter 1:
Motherboards, Processors & Memory

The hardware foundation of every computer system. From form factors to RAM channels, this chapter covers the physical core of CompTIA A+ Domain 3.

24 Slides Domain 3.4 & 3.5 Form Factors • CPU Sockets • RAM • BIOS Exam 220-1101

Slide 2 of 24

What Is a Motherboard?

The main printed circuit board that connects every component in the system.

Definition

The motherboard (also called system board or mainboard) is the primary PCB in a computer. All other components plug into it directly or connect through cables routed to its headers and slots.

What It Connects

CPU, RAM, storage drives (SATA/M.2), expansion cards (PCIe), power supply (24-pin ATX), front panel buttons, USB headers, audio headers, and fan headers. Everything talks through or to the motherboard.

Why It Matters for A+

Form factor, slot type, socket type, and chipset determine what components are compatible. A technician must identify these correctly before recommending or installing hardware.

A client asks why the new CPU they purchased will not fit in their existing board. You look up the socket: LGA 1700 CPU, AM4 socket board. Incompatible. The motherboard must also be replaced. Knowing form factors and sockets is not academic — it saves a truck roll.

Slide 3 of 24

Motherboard Form Factors

Size, mounting holes, and power connectors are standardized by form factor.

Form Factor	Size (inches)	Typical Use	Expansion Slots
ATX	12 × 9.6	Full-size desktops, workstations	Up to 7
Micro-ATX	9.6 × 9.6	Smaller desktops, budget builds	Up to 4
Mini-ITX	6.7 × 6.7	Small form factor, HTPCs	1
Nano-ITX	4.7 × 4.7	Embedded systems, kiosks	Limited
Pico-ITX	3.9 × 2.8	IoT, embedded devices	None/SoC

Exam Tip

ATX is the most common desktop form factor. Micro-ATX boards fit in ATX cases (backward compatible). ATX boards do NOT fit in Micro-ATX cases. More slots = bigger board.

Case Compatibility

Case manuals list supported form factors. An ATX case supports ATX, Micro-ATX, and Mini-ITX. A Micro-ATX case supports Micro-ATX and Mini-ITX only.

Slide 4 of 24

Bus Architecture

Three buses carry all communication between CPU, memory, and peripherals.

Data Bus

Carries the actual data being transferred between the CPU, memory, and I/O devices. Width determines how many bits move in one clock cycle. A 64-bit data bus moves 64 bits per transfer. Wider buses = higher throughput.

Address Bus

Carries memory addresses — locations where data is stored or should be retrieved. A 32-bit address bus can address 2^32 unique locations (4 GB of RAM). A 64-bit address bus can address terabytes. This is why 32-bit OSes cap at 4 GB RAM.

Control Bus

Carries command signals that coordinate activity: read, write, interrupt request, clock signals, bus request/grant. The control bus is bidirectional and manages the timing and flow of all data bus and address bus operations.

Key Concept

The bus connects the CPU to RAM (front-side bus / memory bus) and the CPU to expansion slots (PCIe bus). Bus speed is measured in MHz or GT/s (GigaTransfers per second). A bottleneck on any bus limits overall system performance regardless of CPU speed.

Slide 5 of 24

Chipsets: Northbridge vs. Southbridge

Traditional two-chip design vs. modern Platform Controller Hub (PCH).

Northbridge (Legacy)

Handled the high-speed communication path. Connected CPU to RAM (memory controller), PCIe graphics slot, and the Southbridge. Sat closest to the CPU and ran at a higher clock than the Southbridge. Disappearing by 2010 as CPU manufacturers moved memory and PCIe controllers onto the die.

Southbridge (Legacy)

Handled slower I/O: SATA controller, USB controller, audio, LAN, legacy PCI slots, and the BIOS chip. Connected to the Northbridge via a dedicated high-speed bus. Still present in spirit as the PCH (Platform Controller Hub) on modern boards.

Gold packet

CPU to Northbridge to RAM — high-speed path

Cyan packet

Northbridge to PCIe/GPU — graphics path

DMI connects Northbridge to Southbridge for slower I/O (USB, SATA, Audio, BIOS).

Modern Design: PCH

Today's Intel and AMD CPUs integrate the memory controller and most PCIe lanes directly into the processor die. The discrete Northbridge is gone. The remaining I/O chip is called the Platform Controller Hub (PCH). It handles SATA, USB, PCIe lanes for M.2 and slower devices, audio, and LAN. One chip instead of two.

Exam Note

The A+ exam still references Northbridge/Southbridge terminology. Know both the legacy two-chip model and the modern PCH consolidation.

Slide 6 of 24

Expansion Slots: PCI vs. PCIe

Legacy parallel bus vs. current serial point-to-point standard.

PCI (Legacy)

Peripheral Component Interconnect. Shared parallel bus — all devices on one bus compete for bandwidth. 32-bit or 64-bit versions, 3.3V or 5V signaling. Max bandwidth: 133 MB/s (32-bit) or 533 MB/s (64-bit). Still encountered on older hardware. Slots are white and shorter than PCIe x16 slots.

PCIe (Current Standard)

PCI Express. Serial point-to-point connection using dedicated lanes. Each device gets its own exclusive path to the CPU/PCH. No bandwidth sharing. Scales by adding more lanes (x1, x4, x8, x16). Faster, more efficient, and now the universal standard for all modern expansion cards.

Slot Size	Lanes	PCIe 3.0 BW	Typical Use
PCIe x1	1	~1 GB/s	Sound cards, NICs, USB expansion
PCIe x4	4	~4 GB/s	NVMe SSDs, RAID controllers
PCIe x8	8	~8 GB/s	High-speed storage, secondary GPUs
PCIe x16	16	~16 GB/s	Graphics cards (primary GPU slot)

Slide 7 of 24

PCIe Deep Dive

Generations, lanes, bandwidth, and up-plugging.

PCIe Generations

PCIe 1.0: 0.25 GB/s per lane. PCIe 2.0: 0.5 GB/s. PCIe 3.0: 1 GB/s. PCIe 4.0: 2 GB/s. PCIe 5.0: 4 GB/s. Each generation doubles bandwidth per lane while maintaining backward compatibility with the same physical slot shape.

Up-Plugging

A smaller card (x1, x4, x8) can physically fit in a larger slot (x16) and function correctly. The card runs at its own link width, not the slot's maximum. An x1 card in an x16 slot runs at x1 speed. This is called up-plugging and is fully supported by the standard.

Riser Cards

Used in low-profile and rack-mount cases to change expansion card orientation from vertical to horizontal. Common in 1U/2U servers and slim desktops where there is not enough vertical clearance for a full-height card.

Exam Tip

Know that PCIe is backward and forward compatible — a PCIe 4.0 card works in a PCIe 3.0 slot at reduced speed. The slot physical size does NOT determine the card version; it determines the maximum lane count.

Cannot Down-Plug

A physically larger card (x16) will NOT fit in a smaller slot (x1) without modification. Down-plugging requires cutting open the end of the smaller slot, which voids warranty and is generally not recommended.

Slide 8 of 24

Motherboard Connectors: Power

Two power connectors supply the board and CPU with multiple voltage rails.

24-Pin ATX (P1 Connector)

Main motherboard power connector. Originally 20-pin; expanded to 24-pin with ATX12V 2.x to support higher power PCIe slots. Located near the right edge of the board. Supplies the board with +3.3V, +5V, +12V, -12V, and 5VSB (standby). The 24-pin connector is keyed — it can only install in one orientation.

4/8-Pin EPS (CPU Power)

Additional CPU power connector located near the CPU socket, typically the upper-left corner. The 4-pin version is ATX12V; the 8-pin is EPS12V. High-end and overclocking boards often have two 8-pin connectors. Powers the CPU voltage regulation module (VRM) directly. Missing this connector = no POST.

Rail	Voltage	Typical Use
+12V	12V DC	CPU, PCIe cards, motors, fans
+5V	5V DC	USB ports, SATA data logic, older drives
+3.3V	3.3V DC	RAM, PCIe x1 cards, I/O circuitry
5VSB	5V Standby	Wake-on-LAN, USB charging while off

Slide 9 of 24

Connectors: Storage & Headers

SATA, M.2, and the front-panel header pin block.

SATA & eSATA

Serial ATA for HDDs and SSDs. SATA III = 6 Gbps (practical ~550 MB/s). L-shaped 7-pin data connector, separate 15-pin power. eSATA is external SATA for hot-swappable external drives. Same protocol, different connector form factor and cabling spec.

M.2 Slot

Compact slot for NVMe SSDs (using PCIe lanes, up to 7 GB/s on PCIe 4.0 x4) or SATA SSDs (limited to ~550 MB/s). M.2 key types: M-key supports both NVMe and SATA; B-key SATA only. Screw-mounted, no cable required. Check board specs for whether a slot supports NVMe, SATA, or both.

Front Panel & Headers

Small pin blocks on the board edge. Front panel header: power button, reset button, HDD activity LED, power LED. USB headers: 9-pin USB 2.0, 19-pin USB 3.x. Audio header: HD Audio for front jacks. Fan headers: CPU_FAN (controlled), SYS_FAN (case fans).

Exam Tip

The front panel header is the most misidentified connector for new builders. If the power button does not work after assembly, check the front panel header pin layout in the motherboard manual. PWR_BTN and HDD_LED are adjacent but not interchangeable.

Slide 10 of 24

CPU Socket Types

Where the pins live determines who pays if they get bent.

PGA — Pin Grid Array

Pins are on the CPU. The socket has holes. If pins are bent during installation, the CPU is damaged — an expensive mistake. Used by AMD for AM4 and earlier platforms. Requires a Zero Insertion Force (ZIF) lever to lock and release the CPU without force.

LGA — Land Grid Array

Pins are on the socket (motherboard). The CPU has flat contact pads (lands). If pins are bent, the motherboard is damaged. Used by Intel for all modern platforms (LGA 1200, LGA 1700) and by AMD starting with AM5. A retention bracket and retention mechanism hold the CPU down. No ZIF lever required for alignment.

PGA — Pins on CPU

LGA — Pins on Socket

Exam Focus

On A+ exams: PGA = pins on CPU (AMD legacy AM4 and earlier), LGA = pins on socket (Intel always, AMD AM5+). The question may describe a bent-pin scenario and ask which component is damaged. PGA = bent CPU. LGA = bent socket (motherboard).

Installation Rule

CPUs drop straight down into LGA sockets — no lateral force. Any resistance means misalignment. Both PGA and LGA sockets have a triangle alignment mark on the CPU and socket corner to ensure correct orientation.

Slide 11 of 24

Common CPU Sockets

Current and exam-relevant socket designations for Intel and AMD platforms.

Socket	Type	Manufacturer	Compatible CPUs	Note
LGA 1700	LGA	Intel	12th–14th Gen Core (Alder Lake, Raptor Lake)	Current mainstream Intel
LGA 1200	LGA	Intel	10th–11th Gen Core (Comet Lake, Rocket Lake)	Previous gen
AM5	LGA	AMD	Ryzen 7000 series (Zen 4)	AMD's first LGA socket
AM4	PGA	AMD	Ryzen 1000–5000 (Zen–Zen 3)	Longest-lived socket platform

Socket Compatibility Rule

A CPU must match the board's socket exactly. LGA 1700 and LGA 1200 are not interchangeable despite both being Intel LGA. Always verify socket before purchasing a CPU or motherboard upgrade.

Why AM4 Matters

AMD's AM4 platform spanned 5 CPU generations (2017–2022). Many organizations still run AM4 systems. Recognizing AM4 as PGA (pins on CPU) is frequently tested.

Slide 12 of 24

Processor Architecture

x86, x64, and ARM — instruction sets that determine what software can run.

x86 (32-bit)

Original Intel instruction set architecture. Supports up to 4 GB of RAM (32-bit address space). Still found on some embedded and industrial systems. A 64-bit OS cannot run natively on x86-only hardware. 32-bit applications can run on 64-bit OSes (via WoW64 on Windows).

x64 (AMD64 / Intel 64)

64-bit extension of x86 developed by AMD, later adopted by Intel. Supports terabytes of RAM. All modern desktop and laptop CPUs are x64. Runs both 32-bit and 64-bit software. Required for Windows 11. The A+ exam refers to this as x64 or 64-bit architecture.

ARM (RISC)

Reduced Instruction Set Computing architecture. Lower power consumption than x86/x64. Dominant in smartphones, tablets, and embedded devices. Increasingly present in laptops (Apple M-series, Qualcomm Snapdragon X). Native ARM software is required; x86/x64 apps run only via emulation with performance penalty.

A+ Exam Context

Know that 32-bit OSes are limited to ~4 GB RAM and cannot natively run 64-bit applications. 64-bit OSes can run 32-bit apps. ARM apps do not run natively on x86 without emulation. Compatibility issues between these architectures appear in A+ troubleshooting scenarios.

Slide 13 of 24

Processor Concepts

Multicore, hyper-threading, cache hierarchy, clock speed, and TDP.

Multicore

Multiple independent processing cores on one physical chip. Each core can execute instructions independently. A quad-core CPU has 4 real cores. Improves multitasking and parallel workloads. OS sees each core as a logical processor.

Hyper-Threading / SMT

Intel: Hyper-Threading (HT). AMD: Simultaneous Multithreading (SMT). One physical core handles two instruction threads by reusing idle execution units. A 4-core CPU with HT appears as 8 logical processors in Task Manager. Improves throughput on multithreaded workloads by 20-30%.

Cache Levels

L1: Smallest (32–64 KB per core), fastest, on-die. L2: Larger (256 KB–2 MB per core), slightly slower. L3: Shared across all cores (8–64+ MB), slowest of the three but far faster than RAM. Cache hit = data found without going to RAM. Cache miss = expensive RAM access.

Clock Speed & Boost

Base clock: guaranteed sustained speed. Boost/Turbo clock: short-burst maximum speed when thermal and power headroom allow. Measured in GHz. Higher clock = more instructions per second on the same architecture. Cross-architecture clock comparisons are not meaningful.

TDP — Thermal Design Power

The maximum heat a cooling solution must dissipate under sustained load. Measured in watts. A 65W TDP CPU requires a cooler rated for at least 65W. Exceeding TDP causes thermal throttling — the CPU reduces clock speed to shed heat. TDP also roughly indicates power consumption.

Slide 14 of 24

Virtualization & Security Features

Hardware-assisted virtualization, TPM, and integrated graphics on the CPU die.

VT-x / AMD-V

Intel VT-x (Virtualization Technology) and AMD-V are hardware extensions that allow the CPU to assist hypervisors (VMware, Hyper-V, VirtualBox). Must be enabled in UEFI. Without it, 64-bit VMs cannot run in most hypervisors. Present on all modern desktop CPUs but may be disabled by default in UEFI.

TPM — Trusted Platform Module

Dedicated security chip (or firmware module on modern CPUs) that stores encryption keys, certificates, and hashes. Used by BitLocker, Windows Hello, and Secure Boot. TPM 2.0 is required for Windows 11. Can be a discrete chip (dTPM) or CPU firmware implementation (fTPM/PTT).

Integrated GPU (iGPU)

Many CPUs include a graphics processor on the same die. Intel calls it Intel UHD/Iris Xe Graphics. AMD calls it Radeon Vega/RDNA Graphics. Sufficient for office work, video playback, and basic display output. Does not compete with discrete GPUs for gaming or GPU compute. Useful for diagnostics when a discrete GPU fails.

A help-desk ticket: "I cannot create a VM in Hyper-V on my new workstation." First check: is VT-x/AMD-V enabled in UEFI? Many OEM boards ship with it disabled. One UEFI change, reboot, VM creation succeeds. Knowing this saves an unnecessary hardware escalation.

Slide 15 of 24

RAM: DDR Generations

Double Data Rate generations — not interchangeable despite similar pin counts.

Type	Desktop Pins	Voltage	Speed Range	Max per Module
DDR3	240	1.5V (1.35V low)	800–2133 MT/s	8 GB
DDR4	288	1.2V (1.05V low)	2133–3200+ MT/s	64 GB
DDR5	288	1.1V	4800–6400+ MT/s	128 GB

Not Interchangeable

DDR3, DDR4, and DDR5 all use different notch (key) positions to prevent cross-generation installation. DDR4 and DDR5 both have 288 pins but are NOT compatible — different notch location, different voltage, different electrical signaling. A DDR5 stick physically cannot insert into a DDR4 slot.

DDR5 Architecture Change

DDR5 moved the voltage regulator from the motherboard to the DIMM itself. DDR5 also introduced two independent 32-bit sub-channels per module, effectively doubling internal bandwidth compared to DDR4's single 64-bit channel, even at the same MT/s rating.

Slide 16 of 24

RAM: Form Factors & Channels

DIMM vs. SO-DIMM, memory channels, and ECC for servers.

DIMM (Desktop)

Dual Inline Memory Module. Full-length slot. DDR4 DIMM: 288 pins. DDR3 DIMM: 240 pins. Used in desktops, workstations, and servers. Multiple DIMMs per channel slot. Standard height allows heatspreaders for overclocking kits.

SO-DIMM (Laptop)

Small Outline DIMM. Half the length of a standard DIMM. DDR4 SO-DIMM: 260 pins. DDR5 SO-DIMM: 262 pins. Used in laptops, mini PCs, and some NUC-style systems. Same electrical spec as its full-size counterpart — just a different physical form factor.

Memory Channels

Single: one module, one data path. Dual: two matched modules in paired slots (e.g., A2 + B2), nearly 2x bandwidth. Quad: four matched modules, server-class boards. Install matching capacity sticks in the color-coded paired slots per the manual for dual-channel. Mismatched = single-channel fallback.

ECC Memory

Error-Correcting Code memory adds extra bits per byte to detect and correct single-bit errors in real time. Required for servers and workstations handling financial or medical data. Standard consumer motherboards do not support ECC. ECC modules are physically compatible with non-ECC slots but the ECC function will not operate without chipset and BIOS support.

Slide 17 of 24

BIOS vs. UEFI

Firmware that initializes hardware and hands off to the OS bootloader.

Legacy BIOS

16-bit real mode firmware. Uses MBR (Master Boot Record) partition scheme. Hard limit: 2 TB drives (MBR addressing). Text-based interface navigated with arrow keys. Slow POST. No support for GUID Partition Table (GPT). Mouse input not supported. Common on systems manufactured before ~2012.

UEFI

Unified Extensible Firmware Interface. 32/64-bit mode. Uses GPT (GUID Partition Table). No 2 TB limit — supports drives up to 9.4 ZB theoretically. Graphical interface with mouse support. Faster POST via parallel hardware initialization. Supports Secure Boot. Network stack for firmware updates over LAN. Required for Windows 11.

Feature	Legacy BIOS	UEFI
Bit mode	16-bit	32/64-bit
Partition table	MBR	GPT
Max drive size	2 TB	9.4 ZB
Secure Boot	No	Yes
Boot time	Slow	Fast

Slide 18 of 24

BIOS/UEFI Settings

Key configuration options every A+ technician must know.

Boot Order

Determines which device the system attempts to boot from first. Common options: NVMe SSD, SATA HDD, USB drive, optical, network (PXE). Set USB first when imaging or reinstalling. Set internal drive first for normal operation. An incorrect boot order causes "OS not found" errors.

Secure Boot

UEFI feature that only loads bootloaders signed with trusted keys (Microsoft, distro keys). Prevents rootkits from hijacking the boot process. Must be enabled for Windows 11 compliance. May need to be disabled when installing Linux or running unsigned bootable media. Keys stored in UEFI firmware.

Fan Control & Monitoring

Fan headers can be set to DC (voltage-controlled) or PWM (pulse-width modulation) modes. Temperature thresholds and fan curves configurable. H/W Monitor page shows real-time CPU temp, voltages, and fan RPM. Useful for diagnosing overheating before loading the OS.

XMP / DOCP

eXtreme Memory Profile (Intel) / DOCP (AMD). Enables RAM to run at its rated speed rather than default JEDEC speed. Without XMP, a DDR4-3200 kit runs at 2133 MHz. Enable XMP in UEFI to unlock full rated speed. May require a reboot stability test.

Virtualization & TPM

Intel VT-x / AMD-V: enable before creating VMs. TPM: enable (fTPM on AMD, PTT on Intel) for BitLocker and Windows 11 compliance. Both disabled by default on many OEM boards. A+ exam may describe symptoms of these being disabled and ask for the fix.

Slide 19 of 24

CMOS Battery

The coin cell that keeps your BIOS alive when the system is unplugged.

Purpose

CMOS (Complementary Metal-Oxide Semiconductor) is a small area of memory on the motherboard that stores BIOS/UEFI settings: date/time, boot order, fan curves, overclocking profiles, and hardware enable/disable flags. The CR2032 coin cell battery provides continuous power to CMOS when the system is off or unplugged. Without it, CMOS loses its settings at every power cycle.

CR2032 Battery

Standard 3V lithium coin cell, 20mm diameter, 3.2mm thick. Lasts 3–10 years depending on system usage patterns. Located on the motherboard in a small retention clip, usually near the PCIe x16 slot. Replacement cost: under $2. Replacement procedure: power off, remove AC, swap battery, reenter BIOS settings.

Symptoms of Dead CMOS Battery

System time resets to a default date (often 2000 or 2002) after power loss. BIOS settings do not persist between boots. "CMOS checksum error" or "CMOS battery low" POST warning. System may prompt to enter SETUP on every boot.

Clearing CMOS

Used when a forgotten BIOS password or a failed overclock prevents the system from booting. Method 1: remove the CMOS battery for 30 seconds. Method 2: move the CLRTCMOS jumper to the clear position for 10 seconds. Method 3: use a dedicated BIOS reset button (present on high-end boards). All methods reset BIOS to factory defaults.

Slide 20 of 24

Cooling Systems

Air, liquid, and passive cooling — thermal paste bridges the gap.

Air Cooling

Heat sink + fan (HSF) combination. Heat spreads from the CPU IHS (Integrated Heat Spreader) through the heat sink base into copper heat pipes, then to aluminum fins where a fan moves air over them. Most common cooling type. Low cost, easy to maintain. Works for TDPs up to ~200W with high-end tower coolers. Loud under load.

Liquid / AIO Cooling

All-In-One (AIO) liquid cooler: CPU water block, pump, tubes, radiator. Coolant absorbs heat from the CPU block, pumps to the radiator, fans dissipate heat to the air. Better thermal performance per noise level than air at comparable price. Higher cost, more failure points (pump, fittings, coolant). Custom loops add even more capacity and complexity.

Passive Cooling

No fan. Heat sink only. Silent operation. Limited to low-TDP CPUs (under 15W typically). Used in industrial PCs, embedded systems, and some NUC-style mini PCs. Relies entirely on convection. Adequate ventilation around the case is critical. Any airflow restriction causes thermal shutdown.

Thermal Paste

Applied between the CPU IHS and the heat sink base. Fills microscopic surface imperfections that would otherwise trap air (air is a thermal insulator). Must be reapplied whenever the cooler is removed. Old dried paste has much higher thermal resistance. Common compounds: silicone-based (non-conductive, easy clean), liquid metal (best performance, electrically conductive — use with caution).

Slide 21 of 24

Case Airflow

Intake, exhaust, pressure balance, and why dust filters matter.

Positive Pressure

More intake CFM than exhaust CFM. Air is forced out through all case gaps, preventing dust from entering through unfiltered openings. Reduces dust buildup inside the case. Slightly higher operating temperatures than neutral/negative pressure due to less aggressive exhaust. Best for dusty environments with good dust filters on intake fans.

Negative Pressure

More exhaust CFM than intake CFM. Air is pulled in through all case gaps, including unfiltered openings — dust accumulates faster. Can achieve slightly lower temperatures on components directly in the exhaust path. Requires more frequent cleaning. Avoid in workshop or industrial environments with heavy particulate contamination.

Standard Fan Placement

Front / bottom: intake (cool ambient air in). Rear / top: exhaust (hot air out). PSU: usually exhausts through the rear. CPU cooler fan: pushes toward rear exhaust fan. This creates a front-to-rear airflow channel that efficiently moves heat out of the case.

Common Airflow Mistakes

Fan installed backwards (arrows on frame indicate airflow direction). Intake and exhaust fans on the same side creating recirculation. No cable management blocking airflow path. GPU exhaust pointing into hard drive bay. All of these cause hotspots and early component failure.

Slide 22 of 24

Exam Practice: Quick Questions

Six A+ style scenario questions — answers in gold. Cover them first.

Q1

A technician installs new RAM but the system runs slower than expected with two identical 16 GB sticks. Most likely cause? — Sticks installed in same-color slots (A1+A2) instead of paired slots (A1+B1) — running single-channel instead of dual-channel.

Q2

After a power outage the system boots with the wrong date and prompts for BIOS setup every time. What should the technician replace? — CMOS battery (CR2032).

Q3

A user bought a new Intel 14th Gen CPU for their existing board. It will not fit. The board has an AM4 socket. What is the issue? — Socket incompatibility. Intel 14th Gen requires LGA 1700. AM4 is AMD PGA. Requires a new motherboard.

Q4

A technician enables Hyper-V on a Windows 11 Pro workstation but virtual machines fail to create. What setting is likely disabled? — VT-x / AMD-V (hardware virtualization) in UEFI.

Q5

A Mini-ITX board is ordered for an upgrade. The existing Micro-ATX case is available. Will the board fit? — Yes. Micro-ATX cases support Mini-ITX. Smaller form factors fit in larger cases (not the reverse).

Q6

A PCIe x1 network card is installed in an open PCIe x16 slot. Will it function? — Yes. Up-plugging is supported. The card runs at x1 speed regardless of slot size.

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Key Vocabulary

Chapter 1 terms organized by category.

Motherboard & Slots

ATX/Micro-ATX/Mini-ITX — form factor standards
PCH — Platform Controller Hub (modern Southbridge)
PCIe x1/x4/x8/x16 — expansion slot widths
M.2 — compact NVMe/SATA storage slot
24-pin ATX — main board power connector
EPS 4/8-pin — CPU supplemental power

CPU & Sockets

PGA — Pin Grid Array, pins on CPU (AMD AM4)
LGA — Land Grid Array, pins on socket (Intel, AMD AM5)
SMT / HT — simultaneous multithreading / hyper-threading
TDP — Thermal Design Power (watts)
VT-x / AMD-V — hardware virtualization extensions
IHS — Integrated Heat Spreader (CPU lid)

Memory & Firmware

DIMM / SO-DIMM — desktop / laptop memory module form
DDR4 / DDR5 — current RAM generations, 288 pins each
ECC — Error-Correcting Code memory (servers)
UEFI — modern firmware replacing legacy BIOS
Secure Boot — signed bootloader verification in UEFI
CMOS / CR2032 — settings storage + coin cell battery

Slide 24 of 24 — Chapter 1 Complete

Chapter 1 Summary

Eight key takeaways from Motherboards, Processors & Memory.

1

Form factor determines physical compatibility with the case. ATX > Micro-ATX > Mini-ITX in size. Smaller boards fit in larger cases.

2

PCIe replaced PCI as the expansion slot standard. Up-plugging is supported (smaller card in larger slot). Lane count determines bandwidth, not slot shape alone.

3

CPU sockets are generation and manufacturer specific. PGA has pins on the CPU (AMD AM4). LGA has pins on the socket (Intel, AMD AM5). Never cross-install.

4

DDR generations are not interchangeable. DDR3 (240 pins), DDR4 (288 pins), DDR5 (288 pins, different notch). Lower voltage = each newer generation.

5

UEFI replaced legacy BIOS. Supports GPT, Secure Boot, drives over 2 TB, graphical interface. Required for Windows 11 with TPM 2.0.

6

CMOS battery (CR2032) failure causes date/time reset and lost BIOS settings. Clear CMOS by removing battery or using the CLRTCMOS jumper to reset a locked BIOS.

7

VT-x / AMD-V must be enabled in UEFI before hypervisors (Hyper-V, VMware) can run 64-bit VMs. Disabled by default on many OEM boards.

8

Airflow: front/bottom intake, rear/top exhaust. Positive pressure reduces dust buildup. Thermal paste must be reapplied every time the CPU cooler is removed.